Skip to content
頂程國際股份有限公司 Ding Cheng International

BY PROCESS

Define your process requirements.

Select your conditions and carry the summary into an inquiry for engineering review.

Start with your conditions
Tip: press 1–9 to pick

What is your process objective?

Which class of material are you removing?

METAL
NON-METAL
ORGANIC

Wafer / glass geometry?

Wafer thickness range?

Process temperature range?

CONDITIONS CAPTURED

Your process conditions are captured

PROCESS APPLICATION
NEXT STEP

Business inquiry

Provide only the contact and requirement details needed for this inquiry. Attachments are not accepted.

Fields marked “required” must be completed.

Enter at least 10 and no more than 4,000 characters.

07 / Security verification

Loading security verification. Submission will be enabled when it is ready.

Submitted data is used only to respond to this inquiry and is marked to expire after 90 days. AWS TTL deletes expired records asynchronously, so deletion may occur later. DCI must approve the formal privacy policy before it is published.

T34 DS