Turnkey & Labor service
LAM / TEL / DNS Series
View service scopeWET PROCESS · SINGLE WAFER
WET Process Single Wafer Process Equipment
Process platforms cover Mainframe, EFEM, chemical delivery systems (CDS) and Local Pump Cart configurations.
DCI · SINCE 2007
DING CHENG INTERNATIONAL
Wet process expertise for single wafer tools, from spare parts to turnkey solutions.
Product & Service
T34 DS, T21 DS, S312 and CDS.
T34 DS
Product inquiry guideline
Explore four types of process conditions before starting your product inquiry.
Start your inquiryStart with the purpose of your process.
- Byproduct removal
- Particle removal
- WET etching
- Non-traditional cleaning: CO₂ snow flake sublimation / dry particle removal
Identify the thickness range and processing side.
- Thin · 50–280 μm · Front Side
- Standard · 280–800 μm · Front / Back Side
- Thick · >800 μm · Front / Back Side
Define the temperature range for your process.
- Normal & High Temperature · 25–70 °C
- Ultra High Temperature · 70–120 °C
Specify the shape of the wafer or glass substrate.
- Round
- Square
- Rectangular
CIP / AI MODULES
Intelligence Upgrade & Monitor System
CIP performance optimisation and AI modules.
- MTC
- High-precision chemical temperature control
- WTG
- Wafer temperature gradient management
- SIS
- Signal Integration System
- CPS
- Cyber-physical integration and digital twin
Service
Turnkey & Labor service, site safety support.
Client-site construction safety support
Class A and Class C occupational safety and health operations, specified chemical substance operations, and organic solvent operations.
View safety supportENGINEERING CONSULTATION
Contact
For equipment needs, system upgrades and engineering services, contact our team.
Business inquiry01 / TAINAN
Tainan locationNo. 5-86, Guanghua St., Xinshi Dist., Tainan 74449, TaiwanTEL +886-6-5892601FAX +886-6-5897936
02 / HSINCHU
Hsinchu location14F, No. 203, Xuguang 1st Rd., Zhudong Twp., Hsinchu County, TaiwanTEL +886-6-5892601FAX +886-6-5897936